The first commercially available 3D chip
The pmd PhotonICs® 19k-S3 is the world’s first commercial 3D chip with unrestricted availability. Based onpmd´s Time-of-Flight depth sensing technology the image sensor enables versatile applications based on 3D
imaging. The 3rd dimension yields an advantage in many use cases where 2D imaging is stretched to its limits.
pmd´s ToF chips deliver both – a robust depth map and simultaneously a 2D grayscale image, added value
for a confident 3D measurement.
3D imaging for versatile applications
The pmd chip is not affected by extraneous light due to the patented SBI technology (Suppression of Background Illumination) and can therefore be used both indoors and outdoors, in daylight and night conditions.The chip´s pixel resolution facilitates accurate tracking of fingers for precise gesture control even on HD displays,
10 and more fingers can be recognized at the same time. The high frame rate prevents motion artifacts caused by
fast moving objects. Quick swipes and fast click movements can be detected flawlessly with clever algorithms
based on the 3D depth map to create an enhanced user experience.
Not only close range gesture control but also long range applications are enabled by pmd´s very scalable
technology – depending on the 3D camera module layout.
Selected key features at a glance
- First commercially available 3D Time-of-Flight (ToF) image sensor
- Standard CMOS technology
- Simultaneous recording of depth map and 2D grayscale images
- Fast read-out clock of 15 MPixel/s
- Depth measurement quality independent of ambient light
Parameter
Type of Sensor
Array Size
Pixel pitch
Modulation frequency
Read-out clock
Power Consumption
Power supply
Digital input
Digital output
ESD protection
Temperature range
Package
Package Size
Package Height
Array Size
Pixel pitch
Modulation frequency
Read-out clock
Power Consumption
Power supply
Digital input
Digital output
ESD protection
Temperature range
Package
Package Size
Package Height
Value
PMD PhotonICs® 19k-S3
160x120
45x45μm
Up to 80MHz
3x5MPixel/s
175mW
5V
TTL or CMOS
3.3V – 5V CMOS
2kV HBM
-40°C to +85°C
TLCC40 12x12mm²
12x12mm²
1.9mm
160x120
45x45μm
Up to 80MHz
3x5MPixel/s
175mW
5V
TTL or CMOS
3.3V – 5V CMOS
2kV HBM
-40°C to +85°C
TLCC40 12x12mm²
12x12mm²
1.9mm
Notes
With SBI (Suppression of Background Illumination)
Triple read out structure with 5MHz clock (each). Max load 30pF.
@ 3ms integration time, 5MHz readout speed.
min: 4.9V / max. 5.1V
For TTL: HIGH > 2.0V; LOW < 0.8V
HIGH >4.5V(2.8V); LOW < 0.4V
Bare die on request
Triple read out structure with 5MHz clock (each). Max load 30pF.
@ 3ms integration time, 5MHz readout speed.
min: 4.9V / max. 5.1V
For TTL: HIGH > 2.0V; LOW < 0.8V
HIGH >4.5V(2.8V); LOW < 0.4V
Bare die on request
For detailed information and advice, please contact the pmd team at sales@pmdtec.com
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